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| TA8225HQ/LQ TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic TA8225HQ,TA8225LQ 45W BTL Audio Amplifier The TA8225HQ, TA8225LQ is BTL audio power amplifier for consumer application. It is designed for high power, low distortion and low noise. It contains various kind of protectors and the function of stand-by SW. In addition, the functions of output short or over voltage detection and junction temperature are involved. TA8225HQ Features * High power : POUT (1) = 45W (typ.) (VCC = 14.4V, f = 1kHz, THD = 10%, RL = 2) : POUT (2) = 40W (typ.) (VCC = 13.2V, f = 1kHz, THD = 10%, RL = 2) : POUT (3) = 24W (typ.) (VCC = 13.2V, f = 1kHz, THD = 10%, RL = 4) Low thermal resistance : j-c = 1.5C / W (infinite heat sink) Excellent output power band width : POUT (4) = 18W (typ.) (VCC = 13.2V, f = 50Hz~20kHz, THD = 1%, RL = 4) Low distortion ratio : THD = 0.015% (typ.) (VCC = 13.2V, f = 1kHz, POUT = 4W, RL = 4) TA8225LQ * * Weight HZIP17-P-2.00: 9.8g (typ.) HSIP17-P-2.00: 9.8g (typ.) * * * * * Built-in stand-by function (with pin(1) set at high, power is turned on) Built-in output short or over voltage detection circuit, output to VCC and output to GND short. (Pin(8): Open collector) Built-in junction temperature detection circuit. (Pin(2): Open collector) Built-in various protection circuits * Thermal shut down, Over voltage * Output to GND short * Output to VCC short * Output to Output short * Operating supply voltage: VCC (opr) = 9~18V 1 2006-04-28 TA8225HQ/LQ Block Diagram TA8225HQ/LQ (GV = 40dB) Caution For Use And Method Of Application 1. Voltage gain adjustment Voltage gain GV of this IC is decided by the external feedback resistors Rf1 and Rf2. Gain fluctuation by temperature can be made smaller than they are housed in IC. Voltage gain GV is decided by the following expression: If R0 = 20kRf1 > Rf2 If R0 = 20k > Rf1 > Rf2 GV20og GV20og R f1 + R f2 + 6 (dB) R f2 (R0 // R f1) + R f2 + 6 (dB) R f2 If Rf1 and Rf2 are made small, the following problems may be caused: (1) When output short is released, output DC voltage is not restored. (2) Fluctuation of output DC voltage by current I in (Fig.1). If voltage gain is made small excessively, oscillation may be taken place and therefore, this IC shall be used at GV = 34dB or above. 2 2006-04-28 TA8225HQ/LQ 2. Preventive measure against oscillation For preventing the oscillation, it is advisable to use C4, the condenser of polyester film having small characteristic fluctuation of the temperature and the frequency. The condenser (C6) between input and GND is effective for preventing oscillacion which is generated with feedback signal from an output stage. The resistance R to be series applied to C4 is effective for phase correction of high frequency, and improves the oscillation allowance. Since the oscillation allowance is varied according to the causes described below, perform the temperature test to check the oscillation allowance. (1) Voltage gain to be used (GV setting) (2) Capacity value of condenser (3) Kind of condenser (4) Layout of printed board In case of its use with the voltage gain GV reduced or with the feedback amount increased, care must be taken because the phase-inversion is caused by the high frequency resulting in making the oscillation liable generated. 3. Pop noise A pop noise generated when the power source is turned on depends on rise times of the in-phase side output ((11)pin) and the negative-phase side output ((16)pin), that is, output offset voltage. The following two points may be pointed out as causes for generation the output offset voltage: (1) In-phase and negative-phase NF capacitor charging times (2) Input offset voltage Especially, the factor (2) relates to the pop noise level. 3 2006-04-28 TA8225HQ/LQ (1) In-phase and negative phase NF capacitor charging time In (Fig.2), when the power source is turned on, Q1 and Q2 are turned on, and NF capacitors are charged in the route of VCCQ2RbootCBSoutR0CNF. For instance, if the capacity of an in-phase capacitor is not properly paired with that a negative-phase capacitor, output offset voltage = pop noise is produced because a charging time of NF capacitor differs between the in-phase and negative-phase outputs. Therefore, to suppress the pop noise it is necessary to properly pair the in-phase and negative-phase NF capacitors. Output and NF DC voltage waveforms by the pairing of NF capacitors: CNF are shown in (Fig.3) and (Fig.4). Further, voltage waveforms are shown when the power source was turned on, under the following conditions: VCC = 13.2V, RL = 4, Ta = 25C, and input shot-circuit. Output DC voltage VOUT: (2V / div, 200ms / div) NF DC voltage VNF: (1V / div, 200ms / div) 4 2006-04-28 TA8225HQ/LQ (2) Input offset voltage Input offset voltage is increased by as many times as a gain and appears as output offset voltage. Input offset voltage is affected by an external resistor in addition to properness of pair of capacitor in IC. An example of a general application circuit is shown in (Fig.5). In this case, input to the differential amplifier composing the buffer amplifier is decided to be 30k + 1.1k = 31.1k at the in (+) side and 1.1k at the in (-) side. Therefore a rising difference of about 30 times between the in (+) side and the in (-) side. So, to fit input offset voltages, it is possible to suppress the input offset voltage by adjusting it to 31.1k both at the in (+) and in (-) sides according to the application example shown in (Fig.6). As input coupling capacitors are used in actual set, the circuit shown in (Fig.7) is considered. In this case, it is necessary to take the utmost care of proper pair of CIN (+) and CIN (-). Pop noise level affected by input offset voltage shall be checked on an actually mounted set. 4. Junction temperature detecting pin(2) Using temperature characteristic of a band gap circuit and in proportion to junction temperature, pin(2) DC voltage: V2 rises at about 10mV / C temperature characteristic. So, the relation between V2 at Tj = 25C and V2 at Tj =C is decided by the following expression: V - V2 (25C) Tj (C) = 2 + 25( C) 10mV / C In deciding a heat sink suze, a junction temperature can be easily made clear by measuring voltage at this pin while a backside temperature of IC was so far measured using a thermocouple type thermometer. 5 2006-04-28 TA8225HQ/LQ 5. Output-VCC short, output-GND short and over voltage detecting pin(8) In case of such abnormalities as output-VCC short, output-GND short, overvoltage (Fig.9), it is possible to inform the abnormal state to the outside by turning a NPN transistor is turned on. It is possible to improve the reliability of not only power IC but also an entire equipment by (1) display by LED and LCD and (2) by turning the power supply relay off. 6. Stand-by SW function By means of controlling pin(1) (stand-by terminal) to high and low, the power supply can be set to on and off. The threshold voltage of pin(1) is set at about 3VBE2.1V (typ.), and the power supply current is about 1A (typ.) at the stand-by state. Control voltage of (1)pin: V (SB) Stand-By On Off Power Off On V (SB) (V) 0~2 3~VCC 6 2006-04-28 TA8225HQ/LQ Absolute Maximum Ratings (Ta = 25C) Characteristic Peak supply voltage (0.2s) DC supply voltage Operating supply voltage Output current (peak) Power dissipation Operating temperature Storage temperature Symbol VCC (surge) VCC (DC) VCC (opr) IO (peak) PD Topr Tstg Rating 50 25 18 9 50 Unit V V V A W C C -30~85 -55~150 7 2006-04-28 TA8225HQ/LQ Electrical Characteristics (unless otherwise specified, VCC = 13.2V, RL = 4, Rg = 600, f = 1kHz, Ta = 25C) Characteristic Quiescent current Symbol ICCQ POUT (1) Output power POUT (2) POUT (3) POUT (4) Total harmonic distortion Voltage gain Output noise voltage THD GV VNO (1) VNO (2) Ripple rejection ratio Output offset voltage Current at stand-by state R.R. Voffset ISB Test Cir- cuit -- -- -- -- -- -- -- -- -- -- -- -- VIN = 0 VCC = 14.4V, THD = 10%, RL = 2 THD = 10%, RL = 2 THD = 10% THD = 1%, f = 50Hz~20kHz POUT = 4W VIN = 10mVrms Rg = 0, DIN45405 Noise filter Rg = 0, BW = 20Hz~20kHz f = 100Hz, Vripple = 0.775Vrms (0dBm) VIN = 0 -- Test Condition Min. -- -- 33 20 -- -- 38.5 -- -- 50 Typ. 150 45 40 24 18 0.015 40 0.26 0.23 60 0 1 Max. 250 -- -- -- -- 0.07 41.5 -- 0.5 -- 100 30 Unit mA W W W W % dB mVrms mVrms dB mV A -100 -- Test Circuit TA8225HQ/LQ (GV = 40dB) 8 2006-04-28 TA8225HQ/LQ 9 2006-04-28 TA8225HQ/LQ 10 2006-04-28 TA8225HQ/LQ 11 2006-04-28 TA8225HQ/LQ 12 2006-04-28 TA8225HQ/LQ Package Dimensions Weight: 9.8g (typ.) 13 2006-04-28 TA8225HQ/LQ Package Dimensions Weight: 9.8g (typ.) 14 2006-04-28 TA8225HQ/LQ 15 2006-04-28 TA8225HQ/LQ * Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. * If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. For details on how to connect a protection circuit such as a current limiting resistor or back electromotive force adsorption diode, refer to individual IC datasheets or the IC databook. IC breakdown may cause injury, smoke or ignition. * Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. * Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. * Over current Protection Circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the Over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. * Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the Thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. * Heat Radiation Design When using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. * Installation to Heat Sink Please install the power IC to the heat sink not to apply excessive mechanical stress to the IC. Excessive mechanical stress can lead to package cracks, resulting in a reduction in reliability or breakdown of internal IC chip. In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the use of silicon rubber is prohibited for the IC you intend to use, or not. For details of power IC heat radiation design and heat sink installation, refer to individual technical datasheets or IC databooks. 16 2006-04-28 TA8225HQ/LQ RESTRICTIONS ON PRODUCT USE * The information contained herein is subject to change without notice. 021023_D * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. 021023_A * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. 021023_B * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C * The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E * This product generates heat during normal operation. However, substandard performance or malfunction may cause the product and its peripherals to reach abnormally high temperatures. The product is often the final stage (the external output stage) of a circuit. Substandard performance or malfunction of the destination device to which the circuit supplies output may cause damage to the circuit or to the product. 030619_R 060116EBF About solderability, following conditions were confirmed * Solderability (1) Use of Sn-37Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux 17 2006-04-28 |
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